Rigid Flex PCBs are used as connectors in applications where flexibility, space savings, or production constraints are required.
FPC Technology
| Materials | Polyimide | Polyester | Remark | |
| Number of layers | 1~4 | 1~2 | 0 | |
| Min.Track |
Single Sided |
0.05mm(2mils) | 0 | 0 |
| Width/Spacing | Double Sided | 0.075mm(3mils) | 0 | 0 |
| Min.Hole Diameter |
Drilling P.T.H. | ￠0.30mm | 0 | 0 |
| Punching | ￠0.50mm | 0 | 0 | |
| Dimension Tolerances |
Conductor Width (w) |
±0.02mm | 0 | ≤0.5mm |
| Hole Diameter (h) |
±0.02mm | 0 | ≤1.5mm | |
| Accumulated Pith (p) | ±0.05mm | 0 | ≤25mm | |
| Outline Dimension (L) | ±0.3~0.1mm | 0 | ≤50mm | |
| Conductors and Outline(c) | ±0.1mm | 0 | ≤5.0mm | |
| Conductors and Coverlay | ±0.1mm | 0 | 0 | |
| Surface Treatment on Terminals and land Areas |
Au: 0.05~1.25μm Sn/Pb: 2~10μm Spray tin: Above 20μm |
Adjust by buyer's request | ||
| Insulation Resistance | 500M | IPC-TM-6502 | ||
| Dielectric Strength | 5KV | IPC-TM-6502 | ||
| Dissipation Factor(1MHz) | 0.042 | 0 | MIL-P-55617 | |
| Peeling Strength(kgf/cm) | 1.0 | 1.2hgf/cm | JIS C6481 | |
| Temperature Resistance | -200°C~+300°C | 0 | 0 | |
| Flexibility | <500,000.times | 0 | 0 | |
| <10000 times | 0 | R<6° | ||
| No break in 7 times | 0 | R0° | ||
| Surface Resistance | 5х1012 | 0 | JIS C6481 | |
| Volume Resistivity -CM | 1х1015 | 0 | JIS C6481 | |
| Dielectric Constant(1MHz) | 4.3 | 31 | MIL-P-55617 | |
| Flammability(UL 94) | 94HB | 0 | UL 94 | |
| Insulation Strength KV/mm | 110 | 85 | ASTM D149 | |
| Solder Item | 260°C/10sec | 0 | JIS C6481 | |
FPC Materials
| Material | PI | PET |
| Basic material μm | 12.5、25、50、75、125 | 25、50、75、100 |
| Covered membrane μm | 12.5、25、50、75 | 25、50 |
| CU μm | 18、35、50、70 | 0 |
| CU material | ED RA | 0 |
