People have been designing Printed Circuit Boards (PCBs) for a long time. The process has passed from entirely manual steps to the highly-sophisticated use of Computer Aided Design (CAD) methods.

If the electronic design requires fast removal of heat from its components, the best way to achieve this is to use an Aluminum Printed Circuit Board (PCB).

Our equipment and our gadgets are getting smaller. Not only that, we keep demanding that more goes into them. It’s the same for components for such diverse technologies as medical and military.

The ubiquity of Printed Circuit Boards in modern manufacturing makes it seem that they have been with us forever.

The road from initial design to manufacture is a bumpy one at the best of times. It only takes a slip at an early stage, and budgets and timelines can spiral dangerously out of control. One part of the process that needs to go smoothly, and with no surprises, is the creation of Printed Circuit Board (PCB) prototypes.

Our standard multi-layer PCB stackup is predominantly made up of three components with varying thicknesses of Copper Foil, Pre-preg and Copper clad FR4 laminates as cores.

The solder mask is a coating that protects the circuit from electrical shorts and corrosion as well as providing electrical insulation, allowing higher voltage traces to be placed at a closer proximity to each other.

Multilayer PCBs are made up of two or more PCB’s, which are stacked together to create a reliable mutual connection between them.