Printed Circuit Boards - Flexible and Rigid Flex

Materials

Polyimide

Polyester

Remark

Number of layer

1~4

1~2

0

Min.Track
Width
/Spacing

Single Sided

0.05mm(2mils)

0

0

Double Sided

0.075mm(3mils)

0

0

Min.Hole
Diameter

Drilling P.T.H.

￠0.30mm

0

0

Punching

￠0.50mm

0

0

Dimension
Tolerances

Conductor
Width (w)

±0.02mm

0

≤0.5mm

Hole
Diameter (h)

±0.02mm

0

≤1.5mm

Accumulated Pith (p)

±0.05mm

0

≤25mm

Outline Dimension (L)

±0.3~0.1mm

0

≤50mm

Conductors and Outline(c)

±0.1mm

0

≤5.0mm

Conductors and Coverlay

±0.1mm

00

0

Surface Treatment on Terminals
and land Areas

Au: 0.05~1.25μm
Sn/Pb: 2~10μm
Spray tin: Above 20μm

Adjust by buyer's request

Insulation Resistance

500M

IPC-TM-6502

Dielectric Strength

5KV

IPC-TM-6502

Dissipation Factor(1MHz)

0.042

0

MIL-P-55617

Peeling Strength(kgf/cm)

1.0

1.2hgf/cm

JIS C6481

Temperature Resistance

-200°C~+300°C

0

0

Flexibility

<500,000.times

0

0

<10000 times

0

R<6°

No break in7times

0

R0°

Surface Resistance

5х1012

0

JIS C6481

Volume Resistivity -CM

1х1015

0

JIS C6481

Dielectric Constant(1MHz)

4.3

31

MIL-P-55617

Flammability(UL 94)

94HB

0

UL 94

Insulation Strength KV/mm

110

85

ASTM D149

Solder Item

260°C/10sec

0

JIS C6481